Two standards — Bunch of Wires (BoW) and UCIe — compete with proprietary designs. Today, the latter predominates, since ...

Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has ...

Structural and Thermal Aware Methodology for Placement in 2.5D Integration” was published by researchers at Pennsylvania ...

A new technical paper titled “Memory Prefetching Evaluation of Scientific Applications on A Modern HPC Arm-based Processor” ...

An Open-Source and Configurable RISC-V Graphic Processing Unit for TinyAI Applications” was published by researchers at EPFL.

Just adding more or thicker wires to a design isn't sufficient with chiplets.

High-voltage PCB spacing; HBM4; AI changes engineering teams; ion beam etching; wafer market and raw materials.

Benchmarking 3D-IC cooling; rad-hard flip-flops; high-speed data error correction. Researchers from Massachusetts Institute ...

AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi ...

Supply chain vulnerabilities, hardware attacks, and communications hacks are rife. Autonomous technology poses extra threats.

Ken Tseng was a co-founder and CTO and General manager of China operations for Altos Design in 2005. Prior to Altos, Tseng was an R&D Director at CadMOS and the original author of CeltIC. CadMOS was ...

Currently Ed Blackmond is director of software services for Themis Computer. Prior to this, he was founder of The Standards Joule Company that attempted to combine commercially available battery cells ...